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BS EN IEC 61190-1-3:2018

Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

General Information

Status : Definitive
Standard Type: Main
Document No: BS EN IEC 61190-1-3:2018
Document Year: 2018
Pages: 50
  • Section Volume:
  • GBM21 Electronic Components & Devices (GMB21)
  • ICS:
  • 31.190 Electronic component assemblies

Life Cycle

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Definitive
BS EN IEC 61190-1-3:2018
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