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IEC 60749-19:2003/AMD1:2010 (EN-FR)

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

General Information

Status : ACTIVE
Standard Type: Amendment
Document No: IEC 60749-19:2003/AMD1:2010 (EN-FR)
Document Year: 2010
Pages: 4
Edition: 1.0
  • Section Volume:
  • TC 47 Semiconductor devices
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

Currently Viewing

ACTIVE
IEC 60749-19:2003/AMD1:2010 (EN-FR)
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