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    Semiconductor devices

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    Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    IEC 60747-16-3:2002/AMD2:2017 forword
    Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters

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    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    IEC 60747-16-1:2001+AMD1:2007 CSV forword
    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

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    Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
    IEC 60749-32:2002 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

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    Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
    IEC 60749-21:2011 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

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    Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
    IEC 60749-40:2011 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

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    Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
    IEC 60748-20:1988 (EN-FR) forword
    Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

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    Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories
    IEC 60748-2-10:1994 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories

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    Semiconductor devices - Part 5-14: Optoelectronic devices - Light emitting diodes - Test method of the surface temperature based on the thermoreflectance method
    IEC 60747-5-14:2022 forword
    Semiconductor devices - Part 5-14: Optoelectronic devices - Light emitting diodes - Test method of the surface temperature based on the thermoreflectance method

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    Amendment 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
    IEC 60747-16-5:2013/AMD1:2020 (EN-FR) forword
    Amendment 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

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    Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers
    IEC 60747-5-5:2020 (EN-FR) forword
    Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers

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    • $ 345.07 363.23 | PDF |
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    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    IEC 60747-16-4:2004 forword
    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

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    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    IEC 60747-16-1:2001 (EN-FR) forword
    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

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    Semiconductor devices - Part 1: General
    IEC 60747-1:2006 (EN-FR) forword
    Semiconductor devices - Part 1: General

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    Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
    IEC 60749-34:2010 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

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    Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
    IEC 60749-33:2004 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave

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    Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits
    IEC 60748-3:1986 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits

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    Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
    IEC 60748-20:1988/AMD1:1995 (EN-FR) forword
    Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

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    Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
    IEC 60747-16-5:2013+AMD1:2020 CSV (EN-FR) forword
    Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

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    • $ 555.35 584.58 | PDF |
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    Semiconductor devices - Part 19-2: Smart sensors - Indication of specifications of sensors and power supplies to drive smart sensors for low power operation
    IEC TS 60747-19-2:2021 forword
    Semiconductor devices - Part 19-2: Smart sensors - Indication of specifications of sensors and power supplies to drive smart sensors for low power operation

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    • $ 124.01 130.54 | PDF |
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    Amendment 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
    IEC 60747-16-5:2013/AMD1:2020 forword
    Amendment 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

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    • $ 21.57 22.70 | PDF |
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    Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers
    IEC 60747-5-5:2020 forword
    Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers

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    • $ 345.07 363.23 | PDF |
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    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    IEC 60747-16-1:2001 forword
    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

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    • $ 301.94 317.83 | PDF |
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    Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
    IEC 60749-33:2004 forword
    Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave

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    Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
    IEC 60749-11:2002 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

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    • $ 21.57 22.70 | PDF |
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    Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination
    IEC 60748-20-1:1994 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination

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    • $ 215.67 227.02 | PDF |
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