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    Semiconductor devices

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    Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
    IEC 62047-9:2011 (EN-FR) forword
    Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

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    Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
    IEC 62047-10:2011 (EN-FR) forword
    Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

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    Semiconductor devices - Constant current electromigration test
    IEC 62415:2010 (EN-FR) forword
    Semiconductor devices - Constant current electromigration test

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    Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
    IEC 62047-27:2017 forword
    Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

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    Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
    IEC 62047-8:2011 (EN-FR) forword
    Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

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    Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
    IEC 62047-7:2011 (EN-FR) forword
    Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection

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    Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC)
    IEC 60748-4-2:1993 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC)

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    Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
    IEC 60748-21:1997 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures

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    Semiconductor devices - Integrated circuits - part2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)
    IEC 60748-2-12:2001 (EN-FR) forword
    Semiconductor devices - Integrated circuits - part2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)

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    Semiconductor devices - Part 18-4: Semiconductor bio sensors - Evaluation method of noise characteristics of lens-free CMOS photonic array sensors
    IEC 60747-18-4:2023 forword
    Semiconductor devices - Part 18-4: Semiconductor bio sensors - Evaluation method of noise characteristics of lens-free CMOS photonic array sensors

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    Semiconductor devices - Part 5-13: Optoelectronic devices - Hydrogen sulphide corrosion test for LED packages
    IEC 60747-5-13:2021 forword
    Semiconductor devices - Part 5-13: Optoelectronic devices - Hydrogen sulphide corrosion test for LED packages

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    Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    IEC 60747-16-3:2002/AMD2:2017 (EN-FR) forword
    Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters

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    Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
    IEC 60747-8:2010 (EN-FR) forword
    Semiconductor devices - Discrete devices - Part 8: Field-effect transistors

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    Semiconductor devices - Discrete devices - Part 7: Bipolar transistors
    IEC 60747-7:2010 (EN-FR) forword
    Semiconductor devices - Discrete devices - Part 7: Bipolar transistors

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    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    IEC 60747-16-4:2004+AMD1:2009 CSV (EN-FR) forword
    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

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    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    IEC 60747-16-4:2004+AMD1:2009 CSV forword
    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

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    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    IEC 60747-16-4:2004 (EN-FR) forword
    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

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    Semiconductor devices - Part 1: General
    IEC 60747-1:2006+AMD1:2010 CSV (EN-FR) forword
    Semiconductor devices - Part 1: General

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    Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
    IEC 60749-22:2002 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

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    Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
    IEC 60749-42:2014 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage

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    Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC)
    IEC 60748-4-1:1993 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC)

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    Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approva lprocedures
    IEC 60748-21-1:1997 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approva lprocedures

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    Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
    IEC 60748-2-11:1999 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory

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    Semiconductor devices - Part 5-15: Optoelectronic devices - Light emitting diodes - Test method of the flat-band voltage based on the electroreflectance spectroscopy
    IEC 60747-5-15:2022 forword
    Semiconductor devices - Part 5-15: Optoelectronic devices - Light emitting diodes - Test method of the flat-band voltage based on the electroreflectance spectroscopy

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    Semiconductor devices - Part 19-1: Smart sensors - Control scheme of smart sensors
    IEC 60747-19-1:2019 forword
    Semiconductor devices - Part 19-1: Smart sensors - Control scheme of smart sensors

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