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    Semiconductor devices

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    Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
    IEC 60748-2-2:1992 (EN-FR) forword
    Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU

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    Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters
    IEC 60747-16-8:2022 (EN-FR) forword
    Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters

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    Amendment 2 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    IEC 60747-16-1:2001/AMD2:2017 (EN-FR) forword
    Amendment 2 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

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    Semiconductor devices - Part 2: Discrete devices - Rectifier diodes
    IEC 60747-2:2016 (EN-FR) forword
    Semiconductor devices - Part 2: Discrete devices - Rectifier diodes

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    Semiconductor devices - Part 6: Discrete devices - Thyristors
    IEC 60747-6:2016 (EN-FR) forword
    Semiconductor devices - Part 6: Discrete devices - Thyristors

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    Semiconductor devices - Part 3: Discrete devices: Signal, switching and regulator diodes
    IEC 60747-3:2013 (EN-FR) forword
    Semiconductor devices - Part 3: Discrete devices: Signal, switching and regulator diodes

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    Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
    IEC 60747-16-5:2013 (EN-FR) forword
    Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

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    Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
    IEC 60749-32:2002+AMD1:2010 CSV (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

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    Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
    IEC 60749-23:2004/AMD1:2011 (EN-FR) forword
    Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

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    Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)
    IEC 60748-4-3:2006 forword
    Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)

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    Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
    IEC 60748-22-1:1997 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

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    Amendment 1 - Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
    IEC 60748-2-2:1992/AMD1:1994 (EN-FR) forword
    Amendment 1 - Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU

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    Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
    IEC 60747-5-6:2021 RLV forword
    Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes

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    Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators
    IEC 60747-16-7:2022 (EN-FR) forword
    Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators

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    Semiconductor devices - Part 9: Discrete devices - Insulated-gate bipolar transistors (IGBTs)
    IEC 60747-9:2019 (EN-FR) forword
    Semiconductor devices - Part 9: Discrete devices - Insulated-gate bipolar transistors (IGBTs)

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    • $ 393.60 414.31 | PDF |
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    Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
    IEC 60747-16-10:2004 forword
    Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits

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    • $ 345.07 363.23 | PDF |
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    Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
    IEC 60749-31:2002 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

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    Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis
    IEC TS 61945:2000 (EN-FR) forword
    Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis

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    • $ 43.13 45.40 | PDF |
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    Integrated circuits - Memory devices pin configurations
    IEC 61964:1999 (EN-FR) forword
    Integrated circuits - Memory devices pin configurations

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    Integrated circuits - Manufacturing line approval - Demonstration vehicles
    IEC TS 61944:2000 (EN-FR) forword
    Integrated circuits - Manufacturing line approval - Demonstration vehicles

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    Integrated circuits - Manufacturing line approval application guideline
    IEC 61943:1999 (EN-FR) forword
    Integrated circuits - Manufacturing line approval application guideline

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