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    Semiconductor devices

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    Semiconductor devices - Integrated circuits - Part 2-1: Digital integrated circuits - Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
    IEC 60748-2-1:1991 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 2-1: Digital integrated circuits - Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)

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    Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
    IEC 60747-16-5:2013+AMD1:2020 CSV forword
    Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

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    • $ 555.35 584.58 | PDF |
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    Semiconductor devices - Part 18-1: Semiconductor bio sensors - Test method and data analysis for calibration of lens-free CMOS photonic array sensors
    IEC 60747-18-1:2019 forword
    Semiconductor devices - Part 18-1: Semiconductor bio sensors - Test method and data analysis for calibration of lens-free CMOS photonic array sensors

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    • $ 215.67 227.02 | PDF |
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    Amendment 1 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    IEC 60747-16-4:2004/AMD1:2009 (EN-FR) forword
    Amendment 1 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

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    Amendment 1 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    IEC 60747-16-1:2001/AMD1:2007 (EN-FR) forword
    Amendment 1 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

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    Semiconductor devices - Part 1: General
    IEC 60747-1:2006 forword
    Semiconductor devices - Part 1: General

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    • $ 301.94 317.83 | PDF |
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    Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
    IEC 60749-2:2002 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure

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    Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
    IEC 60749-38:2008 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory

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    Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
    IEC 60748-2:1997 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits

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    • $ 485.26 510.80 | PDF |
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    Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
    IEC 60748-11:1990 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

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    Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
    IEC 60747-5-4:2022 forword
    Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers

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    • $ 269.59 283.78 | PDF |
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    Semiconductor devices - Part 18-5: Semiconductor bio sensors - Evaluation method for light responsivity characteristics of lens-free CMOS photonic array sensor package modules by incident angle of light
    IEC 60747-18-5:2023 forword
    Semiconductor devices - Part 18-5: Semiconductor bio sensors - Evaluation method for light responsivity characteristics of lens-free CMOS photonic array sensor package modules by incident angle of light

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    Amendment 1 - Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
    IEC 60747-8:2010/AMD1:2021 forword
    Amendment 1 - Semiconductor devices - Discrete devices - Part 8: Field-effect transistors

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    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV (EN-FR) forword
    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

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    Semiconductor devices - Part 5-10: Optoelectronic devices - Light emitting diodes - Test method of the internal quantum efficiency based on the room-temperature reference point
    IEC 60747-5-10:2019 forword
    Semiconductor devices - Part 5-10: Optoelectronic devices - Light emitting diodes - Test method of the internal quantum efficiency based on the room-temperature reference point

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    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV forword
    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

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    • $ 436.73 459.72 | PDF |
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    Amendment 1 - Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
    IEC 60747-4:2007/AMD1:2017 (EN-FR) forword
    Amendment 1 - Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors

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    Amendment 1 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    IEC 60747-16-4:2004/AMD1:2009 forword
    Amendment 1 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

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    Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    IEC 60747-16-3:2002+AMD1:2009 CSV (EN-FR) forword
    Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters

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    • $ 501.43 527.82 | PDF |
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    Amendment 1 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    IEC 60747-16-1:2001/AMD1:2007 forword
    Amendment 1 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

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    • $ 124.01 130.54 | PDF |
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    Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
    IEC 60747-14-5:2010 (EN-FR) forword
    Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor

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    • $ 124.01 130.54 | PDF |
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    Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
    IEC 60749-32:2002/AMD1:2010 (EN-FR) forword
    Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

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    • $ 10.78 11.35 | PDF |
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    Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
    IEC 60749-19:2003+AMD1:2010 CSV (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

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    • $ 53.92 56.76 | PDF |
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    Amendment 2 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
    IEC 60748-3:1986/AMD2:1994 (EN-FR) forword
    Amendment 2 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits

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    Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
    IEC 60748-2-9:1994 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories

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    • $ 167.14 175.94 | PDF |
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