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    Printed Electronics

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    Printed electronics - Part 250: Material technologies required in printed electronics for wearable smart devices
    IEC TR 62899-250:2025 forword
    Printed electronics - Part 250: Material technologies required in printed electronics for wearable smart devices

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    Printed electronics - Part 303-2: Equipment - Sheet to sheet printing - Mechanical dimensions
    IEC TR 62899-303-2:2024 forword
    Printed electronics - Part 303-2: Equipment - Sheet to sheet printing - Mechanical dimensions

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    • $ 123.93 130.46 | PDF |
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    Printed Electronics - Part 301-3: Equipment - Contact printing - Rigid master - Method to measure the shape errors of printing plate rollers
    IEC 62899-301-3:2024 forword
    Printed Electronics - Part 301-3: Equipment - Contact printing - Rigid master - Method to measure the shape errors of printing plate rollers

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    Printed electronics - Part 302-4: Medium for inkjet printing dot placement evaluation
    IEC 62899-302-4:2024 forword
    Printed electronics - Part 302-4: Medium for inkjet printing dot placement evaluation

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    Printed electronics - Part 203: Materials - Semiconductor ink
    IEC 62899-203:2024 RLV forword
    Printed electronics - Part 203: Materials - Semiconductor ink

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    • $ 284.51 299.48 | PDF |
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    Printed electronics - Part 203: Materials - Semiconductor ink
    IEC 62899-203:2024 forword
    Printed electronics - Part 203: Materials - Semiconductor ink

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    • $ 167.04 175.83 | PDF |
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    Printed electronics - Part 202-8: Materials - Conductive ink - Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials
    IEC 62899-202-8:2024 forword
    Printed electronics - Part 202-8: Materials - Conductive ink - Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials

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    • $ 86.21 90.75 | PDF |
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    Printed electronics - Part 304-1: Equipment - Sintering - Temperature measurement method for photonic sintering system
    IEC TR 62899-304-1:2023 forword
    Printed electronics - Part 304-1: Equipment - Sintering - Temperature measurement method for photonic sintering system

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    • $ 86.21 90.75 | PDF |
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    Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)
    IEC 62899-202-4:2021 forword
    Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)

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    Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine
    IEC 62899-403-1:2018 forword
    Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine

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    • $ 167.04 175.83 | PDF |
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    Printed electronics - Part 505: Quality assessment - Flexible gas sensor - Mechanical and thermal testing
    IEC 62899-505:2020 forword
    Printed electronics - Part 505: Quality assessment - Flexible gas sensor - Mechanical and thermal testing

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    Amendment 1 - Printed electronics - Part 201: Materials - Substrates
    IEC 62899-201:2016/AMD1:2018 forword
    Amendment 1 - Printed electronics - Part 201: Materials - Substrates

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    • $ 86.21 90.75 | PDF |
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    Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension
    IEC 62899-301-2:2017 forword
    Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension

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    • $ 215.54 226.88 | PDF |
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    Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method
    IEC 62899-202-3:2019 forword
    Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method

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    • $ 86.21 90.75 | PDF |
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    Printed electronics - Part 302-1: Equipment - Inkjet - Imaging based measurement of jetting speed
    IEC 62899-302-1:2017 forword
    Printed electronics - Part 302-1: Equipment - Inkjet - Imaging based measurement of jetting speed

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    • $ 123.93 130.46 | PDF |
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    Printed electronics - Part 401: Printability - Overview
    IEC 62899-401:2017 forword
    Printed electronics - Part 401: Printability - Overview

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    • $ 43.11 45.38 | PDF |
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    Printed electronics - Part 503-1: Quality assessment - Test method of displacement current measurement for printed thin-film transistor
    IEC 62899-503-1:2020 forword
    Printed electronics - Part 503-1: Quality assessment - Test method of displacement current measurement for printed thin-film transistor

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    • $ 86.21 90.75 | PDF |
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    Printed electronics - Part 402-2: Printability - Measurement of qualities - Edge waviness
    IEC 62899-402-2:2020 forword
    Printed electronics - Part 402-2: Printability - Measurement of qualities - Edge waviness

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    • $ 86.21 90.75 | PDF |
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    Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers
    IEC 62899-204:2019 forword
    Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers

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    • $ 167.04 175.83 | PDF |
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    Printed electronics - Part 402-1: Printability - Measurement of qualities - Pattern width
    IEC 62899-402-1:2017 forword
    Printed electronics - Part 402-1: Printability - Measurement of qualities - Pattern width

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    • $ 86.21 90.75 | PDF |
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    Printed electronics - Part 501-1: Quality assessment - Failure modes and mechanical testing - Flexible and/or bendable primary or secondary cells
    IEC 62899-501-1:2019 forword
    Printed electronics - Part 501-1: Quality assessment - Failure modes and mechanical testing - Flexible and/or bendable primary or secondary cells

    Special discount of 5%

    • $ 86.21 90.75 | PDF |
    • $ 86.21 90.75 | PRINT |
    Printed electronics - Part 302-2: Equipment - Inkjet - Imaging-based measurement of droplet volume
    IEC 62899-302-2:2018 forword
    Printed electronics - Part 302-2: Equipment - Inkjet - Imaging-based measurement of droplet volume

    Special discount of 5%

    • $ 123.93 130.46 | PDF |
    • $ 123.93 130.46 | PRINT |
    Printed electronics - Part 303-1: Equipment - Roll-to-roll printing - Mechanical dimensions
    IEC 62899-303-1:2018 forword
    Printed electronics - Part 303-1: Equipment - Roll-to-roll printing - Mechanical dimensions

    Special discount of 5%

    • $ 43.11 45.38 | PDF |
    • $ 43.11 45.38 | PRINT |
    Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
    IEC 62899-202-5:2018 forword
    Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

    Special discount of 5%

    • $ 86.21 90.75 | PDF |
    • $ 86.21 90.75 | PRINT |
    Printed electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension
    IEC 62899-301-1:2017 forword
    Printed electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension

    Special discount of 5%

    • $ 167.04 175.83 | PDF |
    • $ 167.04 175.83 | PRINT |
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