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    Electronics assembly technology

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    Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
    IEC TR 60068-3-12:2022 forword
    Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

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    Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-58:2015/AMD1:2017 (EN-FR) forword
    Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

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    Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-58:2015/AMD1:2017 forword
    Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

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    Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 60068-2-20:2021 RLV forword
    Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

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    Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 60068-2-21:2021 (EN-FR) forword
    Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

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    Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies
    IEC 60068-2-82:2019 (EN-FR) forword
    Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies

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    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    IEC 60068-2-69:2017 (EN-FR) forword
    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

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    Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
    IEC 60068-2-83:2011 (EN-FR) forword
    Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

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    Behavioural languages - Part 6: VHDL Analog and Mixed-Signal Extensions
    IEC 61691-6:2021 forword
    Behavioural languages - Part 6: VHDL Analog and Mixed-Signal Extensions

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    Behavioural languages - Part 8: Standard SystemC Analog/Mixed-Signal Extensions Language Reference Manual
    IEC 61691-8:2021 forword
    Behavioural languages - Part 8: Standard SystemC Analog/Mixed-Signal Extensions Language Reference Manual

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    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
    IEC 62739-3:2017 (EN-FR) forword
    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

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    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
    IEC 62739-3:2017 forword
    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

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    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
    IEC 62739-2:2016 (EN-FR) forword
    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing

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    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
    IEC 62739-1:2013 (EN-FR) forword
    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

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    Quality of Electronic and Software Intellectual Property Used in System and System on Chip (SoC) Designs
    IEC 62014-5:2015 forword
    Quality of Electronic and Software Intellectual Property Used in System and System on Chip (SoC) Designs

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    IP-XACT, Standard Structure for Packaging, Integrating, and Reusing IP within Tool Flows
    IEC 62014-4:2015 forword
    IP-XACT, Standard Structure for Packaging, Integrating, and Reusing IP within Tool Flows

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    Artificial Intelligence Exchange and Service Tie to All Test Environments (AI-ESTATE)
    IEC 62243:2012 forword
    Artificial Intelligence Exchange and Service Tie to All Test Environments (AI-ESTATE)

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    Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
    IEC 62137-3:2011 (EN-FR) forword
    Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

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    Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
    IEC 62137-1-5:2009 (EN-FR) forword
    Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

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    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
    IEC 62137-1-4:2009 (EN-FR) forword
    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

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    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
    IEC 62137-1-3:2008 (EN-FR) forword
    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

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    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
    IEC 62137-1-2:2007 (EN-FR) forword
    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

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    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
    IEC 62137-1-2:2007 forword
    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

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    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
    IEC 62137-1-1:2007 (EN-FR) forword
    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

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    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
    IEC 62137-1-1:2007 forword
    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

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