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    Electronics assembly technology

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    Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
    IEC 62878-2-603:2025 forword
    Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

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    Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies
    IEC 60194-2:2025 forword
    Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies

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    • $ 301.75 317.63 | PDF |
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    Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
    IEC 61188-6-3:2024 forword
    Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

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    • $ 269.42 283.60 | PDF |
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    Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
    IEC 61189-2-809:2024 forword
    Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

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    • $ 43.11 45.38 | PDF |
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    Environmental testing - Part 3-82: Supporting documentation and guidance - Confirmation of the performance of whisker test method
    IEC TR 60068-3-82:2024 forword
    Environmental testing - Part 3-82: Supporting documentation and guidance - Confirmation of the performance of whisker test method

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    • $ 344.86 363.01 | PDF |
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    Standard for Signal and Test Definition
    IEC 62529:2024 forword
    Standard for Signal and Test Definition

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    • $ 484.96 510.48 | PDF |
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    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
    IEC 61189-2-808:2024 forword
    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

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    • $ 123.93 130.46 | PDF |
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    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
    IEC 61189-2-805:2024 forword
    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA

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    Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
    IEC 61189-2-720:2024 forword
    Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance

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    • $ 43.11 45.38 | PDF |
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    Corrigendum 1 - Delay and power calculation standards - Part 4: Design and Verification of Low-Power, Energy-Aware Electronic Systems
    IEC 61523-4:2023/COR1:2024 forword
    Corrigendum 1 - Delay and power calculation standards - Part 4: Design and Verification of Low-Power, Energy-Aware Electronic Systems
    • $ 0.00 | PDF |
    Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering
    IEC TR 60068-3-15:2024 forword
    Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering

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    • $ 215.54 226.88 | PDF |
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    Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
    IEC TR 61760-5-1:2024 forword
    Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components

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    • $ 167.04 175.83 | PDF |
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    Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
    IEC TS 62878-2-10:2024 forword
    Device embedding assembly technology - Part 2-10: Design specification for cavity substrate

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    • $ 43.11 45.38 | PDF |
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    Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
    IEC 63251:2023 forword
    Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

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    • $ 167.04 175.83 | PDF |
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    Software-Hardware Interface for Multi-Many-Core
    IEC 63504-2804:2023 forword
    Software-Hardware Interface for Multi-Many-Core

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    • $ 393.35 414.06 | PDF |
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    Power Modeling to Enable System Level Analysis
    IEC 63501-2416:2023 forword
    Power Modeling to Enable System Level Analysis

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    • $ 393.35 414.06 | PDF |
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    Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices
    IEC 63215-2:2023 forword
    Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices

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    • $ 167.04 175.83 | PDF |
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    Format for LSI-Package-Board Interoperable design
    IEC 63055 : 2023 forword
    Format for LSI-Package-Board Interoperable design

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    • $ 484.96 510.48 | PDF |
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    SystemVerilog - Part 2: Universal Verification Methodology Language Reference Manual
    IEC 62530-2 : 2023 forword
    SystemVerilog - Part 2: Universal Verification Methodology Language Reference Manual

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    • $ 484.96 510.48 | PDF |
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    Behavioural languages - Part 1-1: VHDL Language Reference Manual
    IEC 61691-1-1 : 2023 forword
    Behavioural languages - Part 1-1: VHDL Language Reference Manual

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    • $ 484.96 510.48 | PDF |
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    Delay and power calculation standards - Part 4: Design and Verification of Low-Power, Energy-Aware Electronic Systems
    IEC 61523-4 : 2023 forword
    Delay and power calculation standards - Part 4: Design and Verification of Low-Power, Energy-Aware Electronic Systems

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    • $ 484.96 510.48 | PDF |
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    Delay and power calculation standards - Part 1: Integrated Circuit (IC) Open Library Architecture (OLA)
    IEC 61523-1 : 2023 forword
    Delay and power calculation standards - Part 1: Integrated Circuit (IC) Open Library Architecture (OLA)

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    • $ 484.96 510.48 | PDF |
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    Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 61191-2:2017/COR1:2019 forword
    Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    • $ 0.00 | PDF |
    Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)
    IEC 60068-2-69:2017/COR1:2018 forword
    Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)
    • $ 0.00 | PDF |
    Mapping rules and exchange methods for heterogeneous electronic parts libraries - Part 1: Building an integrated search system
    IEC TR 62699-1:2014 forword
    Mapping rules and exchange methods for heterogeneous electronic parts libraries - Part 1: Building an integrated search system

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    • $ 269.42 283.60 | PDF |
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