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    Semiconductor devices in general

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    Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD15:2006 (EN-FR) forword
    Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD3:2001 (EN-FR) forword
    Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD14:2006 (EN-FR) forword
    Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Nineteenth supplement
    IEC 60191-2U:1997 (EN-FR) forword
    Nineteenth supplement

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    Eighteenth supplement
    IEC 60191-2T:1996 (EN-FR) forword
    Eighteenth supplement

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    Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD13:2006 (EN-FR) forword
    Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD9:2003 (EN-FR) forword
    Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Amendment 12 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD12:2006 (EN-FR) forword
    Amendment 12 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
    IEC 60191-2:1966/AMD8:2003 (EN-FR) forword
    Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

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    Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD11:2004 (EN-FR) forword
    Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD10:2004 (EN-FR) forword
    Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2X:1999 (EN-FR) forword
    Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD1:2001 (EN-FR) forword
    Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Twenty-first supplement
    IEC 60191-2W:1999 (EN-FR) forword
    Twenty-first supplement

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    Twentieth supplement
    IEC 60191-2V:1998 (EN-FR) forword
    Twentieth supplement

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    Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:2012 DB (EN-FR) forword
    Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Mechanical standardization of semiconductor devices. Part 2: Dimensions
    IEC 60191-2:1966 (EN-FR) forword
    Mechanical standardization of semiconductor devices. Part 2: Dimensions

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    Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
    IEC 60191-2:1966/AMD7:2002 (EN-FR) forword
    Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

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    Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD2:2001 (EN-FR) forword
    Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
    IEC 60749-18:2019 RLV forword
    Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

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    Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
    IEC 60749-18:2019 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

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    Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
    IEC 60749-30:2020 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

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    Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
    IEC 60749-17:2019 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

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    Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
    IEC 60749-35:2006 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

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    Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
    IEC 60749-12:2017 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

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