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    Semiconductor devices in general

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    Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
    IEC 60749-21:2011 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

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    Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
    IEC 60749-40:2011 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

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    Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers
    IEC 60747-5-5:2020 (EN-FR) forword
    Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers

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    Semiconductor devices - Part 1: General
    IEC 60747-1:2006 (EN-FR) forword
    Semiconductor devices - Part 1: General

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    Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
    IEC 60749-34:2010 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

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    Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
    IEC 60749-33:2004 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave

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    Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers
    IEC 60747-5-5:2020 forword
    Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers

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    Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
    IEC 60749-33:2004 forword
    Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave

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    Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
    IEC 60749-11:2002 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

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    Semiconductor devices - Part 1: General
    IEC 60747-1:2006 forword
    Semiconductor devices - Part 1: General

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    Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
    IEC 60749-2:2002 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure

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    Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
    IEC 60749-38:2008 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory

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    Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
    IEC 60747-5-4:2022 forword
    Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers

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    Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
    IEC 60747-14-5:2010 (EN-FR) forword
    Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor

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    Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
    IEC 60749-32:2002/AMD1:2010 (EN-FR) forword
    Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

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    Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
    IEC 60749-19:2003+AMD1:2010 CSV (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

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    Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
    IEC 60747-14-11:2021 forword
    Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature

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    Amendment 1 - Semiconductor devices - Part 1: General
    IEC 60747-1:2006/AMD1:2010 (EN-FR) forword
    Amendment 1 - Semiconductor devices - Part 1: General

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    Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
    IEC 60749-19:2003 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

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    Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
    IEC 60747-14-4:2011 (EN-FR) forword
    Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers

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    Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
    IEC 60749-27:2006 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)

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    Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
    IEC 60749-19:2003/AMD1:2010 (EN-FR) forword
    Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

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    Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
    IEC 60050-521:2002/AMD1:2017 (EN-FR) forword
    Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits

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    Amendment 1 - VMEbus - Microprocessor system bus for 1 byte to 4 byte data
    IEC 60821:1991/AMD1:1999 forword
    Amendment 1 - VMEbus - Microprocessor system bus for 1 byte to 4 byte data

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    Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
    IEC 60191-6-5:2001 forword
    Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

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