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    Semiconductor devices

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    Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
    IEC 60191-6-21:2010 (EN-FR) forword
    Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

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    Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
    IEC 60191-6-12:2011 (EN-FR) forword
    Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

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    Electrostatic discharge sensitivity testing - Transmission line pulse (TLP) - Component level
    IEC 62615:2010 (EN-FR) forword
    Electrostatic discharge sensitivity testing - Transmission line pulse (TLP) - Component level

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    Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
    IEC 62047-30:2017 forword
    Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

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    Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
    IEC 62047-29:2017 forword
    Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

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    Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
    IEC 62047-19:2013 (EN-FR) forword
    Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses

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    Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 4: Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence
    IEC 63068-4:2022 forword
    Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 4: Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence

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    Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection
    IEC 63068-2:2019 forword
    Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection

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    Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence
    IEC 63068-3:2020 (EN-FR) forword
    Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence

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    Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects
    IEC 63068-1:2019 forword
    Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects

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    Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
    IEC 63244-1:2021 (EN-FR) forword
    Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications

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    Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
    IEC TR 63378-1:2021 forword
    Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

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    Semiconductor devices - Scan based ageing level estimation for semiconductor devices
    IEC TR 63133:2017 forword
    Semiconductor devices - Scan based ageing level estimation for semiconductor devices

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    Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD19:2012 (EN-FR) forword
    Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD18:2011 (EN-FR) forword
    Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
    IEC 60191-2:1966/AMD6:2002 (EN-FR) forword
    Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

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    Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD17:2008 (EN-FR) forword
    Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
    IEC 60191-2:1966/AMD5:2002 (EN-FR) forword
    Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

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    Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD16:2007 (EN-FR) forword
    Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD4:2001 (EN-FR) forword
    Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD15:2006 (EN-FR) forword
    Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD3:2001 (EN-FR) forword
    Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-2:1966/AMD14:2006 (EN-FR) forword
    Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

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    Nineteenth supplement
    IEC 60191-2U:1997 (EN-FR) forword
    Nineteenth supplement

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    Eighteenth supplement
    IEC 60191-2T:1996 (EN-FR) forword
    Eighteenth supplement

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