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    Semiconductor devices

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    Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
    IEC 60749-42:2014 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage

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    Semiconductor devices - Part 5-15: Optoelectronic devices - Light emitting diodes - Test method of the flat-band voltage based on the electroreflectance spectroscopy
    IEC 60747-5-15:2022 forword
    Semiconductor devices - Part 5-15: Optoelectronic devices - Light emitting diodes - Test method of the flat-band voltage based on the electroreflectance spectroscopy

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    Semiconductor devices - Part 19-1: Smart sensors - Control scheme of smart sensors
    IEC 60747-19-1:2019 forword
    Semiconductor devices - Part 19-1: Smart sensors - Control scheme of smart sensors

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    Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    IEC 60747-16-3:2002/AMD2:2017 forword
    Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters

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    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    IEC 60747-16-1:2001+AMD1:2007 CSV forword
    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

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    Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
    IEC 60749-32:2002 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

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    Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
    IEC 60749-21:2011 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

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    Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
    IEC 60749-40:2011 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

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    Semiconductor devices - Part 5-14: Optoelectronic devices - Light emitting diodes - Test method of the surface temperature based on the thermoreflectance method
    IEC 60747-5-14:2022 forword
    Semiconductor devices - Part 5-14: Optoelectronic devices - Light emitting diodes - Test method of the surface temperature based on the thermoreflectance method

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    Amendment 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
    IEC 60747-16-5:2013/AMD1:2020 (EN-FR) forword
    Amendment 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

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    Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers
    IEC 60747-5-5:2020 (EN-FR) forword
    Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers

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    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    IEC 60747-16-4:2004 forword
    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

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    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    IEC 60747-16-1:2001 (EN-FR) forword
    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

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    Semiconductor devices - Part 1: General
    IEC 60747-1:2006 (EN-FR) forword
    Semiconductor devices - Part 1: General

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    Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
    IEC 60749-34:2010 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

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    Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
    IEC 60749-33:2004 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave

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    Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
    IEC 60747-16-5:2013+AMD1:2020 CSV (EN-FR) forword
    Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

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    Semiconductor devices - Part 19-2: Smart sensors - Indication of specifications of sensors and power supplies to drive smart sensors for low power operation
    IEC TS 60747-19-2:2021 forword
    Semiconductor devices - Part 19-2: Smart sensors - Indication of specifications of sensors and power supplies to drive smart sensors for low power operation

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    Amendment 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
    IEC 60747-16-5:2013/AMD1:2020 forword
    Amendment 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

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    Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers
    IEC 60747-5-5:2020 forword
    Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers

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    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    IEC 60747-16-1:2001 forword
    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

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    • $ 301.75 317.63 | PDF |
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    Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
    IEC 60749-33:2004 forword
    Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave

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    Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
    IEC 60749-11:2002 (EN-FR) forword
    Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

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    • $ 21.55 22.69 | PDF |
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    Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
    IEC 60747-16-5:2013+AMD1:2020 CSV forword
    Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

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    Semiconductor devices - Part 18-1: Semiconductor bio sensors - Test method and data analysis for calibration of lens-free CMOS photonic array sensors
    IEC 60747-18-1:2019 forword
    Semiconductor devices - Part 18-1: Semiconductor bio sensors - Test method and data analysis for calibration of lens-free CMOS photonic array sensors

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    • $ 215.54 226.88 | PDF |
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