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    Integrated circuits. Microelectronics

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    Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers
    IEC 62228-2:2016 (EN-FR) forword
    Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers

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    Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method
    IEC 62215-3:2013 (EN-FR) forword
    Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method

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    Integrated circuits - Measurement of impulse immunity - Part 2: Synchronous transient injection method
    IEC TS 62215-2:2007 forword
    Integrated circuits - Measurement of impulse immunity - Part 2: Synchronous transient injection method

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    Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions
    IEC 61967-1:2018 RLV forword
    Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions

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    Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method
    IEC 61967-4:2021 (EN-FR) forword
    Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method

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    Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions
    IEC 61967-1:2018 (EN-FR) forword
    Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions

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    Integrated circuits - Measurement of electromagnetic emissions - Part 1-1: General conditions and definitions - Near-field scan data exchange format
    IEC TR 61967-1-1:2015 forword
    Integrated circuits - Measurement of electromagnetic emissions - Part 1-1: General conditions and definitions - Near-field scan data exchange format

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    Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
    IEC 61967-6:2002 (EN-FR) forword
    Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

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    Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
    IEC 61967-6:2002+AMD1:2008 CSV (EN-FR) forword
    Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

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    Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
    IEC 61967-6:2002/AMD1:2008 (EN-FR) forword
    Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

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    Logic digital integrated circuits - Specification for I/O interface model for integrated circuit (IMIC version 1.3)
    IEC TS 62404:2007 forword
    Logic digital integrated circuits - Specification for I/O interface model for integrated circuit (IMIC version 1.3)

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    Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC)
    IEC 60748-4-2:1993 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC)

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    Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
    IEC 60748-21:1997 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures

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    Semiconductor devices - Integrated circuits - part2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)
    IEC 60748-2-12:2001 (EN-FR) forword
    Semiconductor devices - Integrated circuits - part2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)

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    Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC)
    IEC 60748-4-1:1993 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC)

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    Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approva lprocedures
    IEC 60748-21-1:1997 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approva lprocedures

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    Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
    IEC 60748-2-11:1999 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory

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    Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
    IEC 60748-20:1988 (EN-FR) forword
    Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

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    Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories
    IEC 60748-2-10:1994 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories

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    Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits
    IEC 60748-3:1986 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits

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    Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
    IEC 60748-20:1988/AMD1:1995 (EN-FR) forword
    Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

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    Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination
    IEC 60748-20-1:1994 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination

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    Semiconductor devices - Integrated circuits - Part 2-1: Digital integrated circuits - Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
    IEC 60748-2-1:1991 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 2-1: Digital integrated circuits - Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)

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    Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
    IEC 60748-2:1997 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits

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    • $ 484.96 510.48 | PDF |
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    Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
    IEC 60748-11:1990 (EN-FR) forword
    Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

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    • $ 269.42 283.60 | PDF |
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